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Communication System PCBA BGA QFN Assembly
PCBA Capability
SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB Assembly Services. Compliant with a wide range of standards including IPC 610 Class 2 and Class 3.
The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ),
EMS capacity can reach 150,000,000 components per month.
Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can
be cut and delivered inside of 4 hours.
Order Conditions | Standard Delivery Date | The fastest Delivery Date |
Prototype ( <20pcs) | 2days | 8hours |
Small Volume (20-100pcs) | 6days | 12hours |
Medium Volume (100-1000) | 3days | 24hours |
Mass Production (>1000) | Depends on BOM | Depends on BOM |